Winbond代理商介紹Winbond Serial Flash系列產(chǎn)品特點(diǎn)
Winbond（華邦）Serial Flash系列產(chǎn)品特點(diǎn) ：
•體積小— 由于串行flash采用比并行flash更少的連線在一個(gè)系統(tǒng)中傳送數(shù)據(jù)，所以縮小的系統(tǒng)板的空間，能常采用SOIC8、DFN、BGA等封裝；
•低功耗 — 串行SPI FLASH器件采用串行接口進(jìn)行連續(xù)數(shù)據(jù)存取，所以可以達(dá)到工作電流：7mA 待機(jī)電流：8uA；
•工作溫度范圍寬 - 最新的Q版本工作溫度在-40 to +105；
•快速擦除燒錄程式 —通過(guò)4KByte統(tǒng)一Sector-Erase,32Kbyte或者64Kbyte Block-Erase或者Chip- Erase能力，目前已達(dá)到數(shù)據(jù)擦除：18mS；
•成本低，用途廣 - 由于是臺(tái)灣生產(chǎn)與加工，無(wú)形中降低了很多成本。廣泛應(yīng)用于數(shù)碼類(lèi)以及消費(fèi)類(lèi)電子產(chǎn)品中；
•產(chǎn)品線長(zhǎng) - 串行SPI FLASH產(chǎn)品提供512Kb - 128Mb的密度、I2C、Microwire 和 SPI 兼容協(xié)議。
Winbond Serial Flash系列規(guī)格參數(shù)
| Part No. | Density | Voltage | Temp Range | Max Freq | Package(s) |
| W25X05CL | 512Kb(64KB*8) | 2.3V-3.6V | -40°C to +85°C | 104MHz(208Mhz Dual-SPI) | SOIC8(150mil) TSSOP8(173mil) WSON8(6*5mm) USON8(2*3mm) |
| W25X10CL | 1Mb(128KB*8) | 2.3V-3.6V | -40°C to +85°C | 104MHz(208Mhz Dual-SPI) | SOIC8(150mil) TSSOP8(173mil)WSON8(6*5mm) USON8(2*3mm) |
| W25X10BVSSIG | 1Mb(128KB*8) | 2.7V-3.6V | -40°C to +85°C | 104MHz(208Mhz Dual-SPI) | SOIC8(150mil) WSON8(6*5mm) |
| W25X10BL | 1Mb(128KB*8) | 2.3V-3.6V | -40°C to +85°C | 50MHz(100Mhz Dual-SPI) | SOIC8(150mil) WSON8(6*5mm) |
| W25X20CL | 2Mb(256KB*8) | 2.3V-3.6V | -40°C to +85°C | 104MHz(208Mhz Dual-SPI) | SOIC8(150mil) TSSOP8(173mil) WSON8(6*5mm) USON8(2*3mm) |
| W25X20BVSSIG | 2Mb(256KB*8) | 2.7V-3.6V | -40°C to +85°C | 104MHz(208Mhz Dual-SPI) | SOIC-8(150mil) WSON8(6*5mm) |
| W25X20BL | 2Mb(256KB*8) | 2.3V-3.6V | -40°C to +85°C | 50MHz(100Mhz Dual-SPI) | SOIC8(150mil) WSON8(6*5mm) |
| W25X20BW | 2Mb(256KB*8) | 1.65V-1.95V | -40°C to +85°C | 80MHz(160/320Mhz Dual-SPI) | SOIC8(150mil) WSON8(6*5mm) |
| W25X40BVSSIG | 4Mb(512KB*8) | 2.7V-3.6V | -40°C to +85°C | 104MHz(208Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) PDIP8(300mil) |
| W25X40BL | 4Mb(512KB*8) | 2.3V-3.6V | -40°C to +85°C | 50MHz(100Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) PDIP8(300mil) |
| W25Q40BVSSIG | 4Mb(512KB*8) | 2.7V-3.6V | -40°C to +85°C | 80/104MHz(160/320Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) PDIP8(300mil) |
| W25Q40BL | 4Mb(512KB*8) | 2.3V-3.6V | -40°C to +85°C | 50MHz(100/200Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) PDIP8(300mil) |
| W25Q40BW | 4Mb(512KB*8) | 1.65V-1.95V | -40°C to +85°C | 80MHz(160/320Mhz Dual-SPI) | SOIC8(150mil) WSON8(6*5mm) |
| W25Q80BVSSIG | 8Mb(1MB*8) | 2.7V-3.6V | -40°C to +85°C | 80/104MHz(160/320Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) PDIP8(300mil) |
| W25Q80BL | 8Mb(1MB*8) | 2.3V-3.6V | -40°C to +85°C | 50MHz(100/200Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) PDIP8(300mil) |
| W25Q80BW | 8Mb(1MB*8) | 1.65V-1.95V | -40°C to +85°C | 80MHz(160/320Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) |
| W25Q16BVSSIG | 16Mb(2MB*8) | 2.7V-3.6V | -40°C to +85°C | 80/104MHz(160/320Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) SOIC16(300mil) WSON8(6*5mm)PDIP8(300mil) |
| W25Q32BVSSIG | 32Mb(4MB*8) | 2.7V-3.6V | -40°C to +85°C | 104/80MHz(208/320Mhz Dual-SPI) | SOIC8(208mil) SOIC16(300mil) WSON8(6*5mm) WSON8(8*6mm)PDIP8 (300mil) TFBGA24(6*8mm) |
| W25Q64DWSTIM | 64Mb(8MB*8) | 1.65V-1.95V | -40°C to +85°C | 50MHz(100/200Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) SOIC16(300mil)WSON8(6*5mm) PDIP8(300mil) |
| W25Q64FVDAIG | 64Mb(8MB*8) | 2.3V-3.6V | -40°C to +85°C | 104MHz(208/416Mhz Dual-SPI) | SOIC8(150mil) SOIC8(208mil) WSON8(6*5mm) PDIP8(300mil) TFBGA24(6*8mm) |
| W25Q64BVFIG | 64Mb(8MB*8) | 2.7V-3.6V | -40 to +85 -40 to +105 | 104/80MHz(208/320Mhz Dual-SPI) | SOIC8(208mil) SOIC16(300mil) WSON8(6*5mm) WSON8(8*6mm) PDIP8(300mil) TFBGA24(6*8mm) |
| W25Q64BVSSIG | 64Mb(8MB*8) | 2.7V-3.6V | -40°C to +85°C | 104MHz(208/416Mhz Dual-SPI) | SOIC8(208mil) SOIC16(300mil) WSON8(6*5mm) WSON8(8*6mm) TFBGA24(6*8mm) |
| W25Q64BVSSIG | 64Mb(8MB*8) | 2.7V-3.6V | -40°C to +85°C | 80MHz(160/320MhzDual/Quad-SPI) | SOIC8(208mil) SOIC16(300mil) WSON8(8*6mm) PDIP8(300mil) |
| W25Q64CVSSIG | 64Mb(8MB*8) | 2.7V-3.6V | -40 to +85 -40 to +105 | 80MHz(160/320MhzDual/Quad-SPI) | SOIC8(208mil) SOIC16(300mil) WSON8(6*5mm) PDIP8(300mil) TFBGA24(6*8mm) |
| W25Q128FVSSIG | 128Mb(16MB*8) | 2.7V-3.6V | -40°C to +85°C | 104MHz(208/416Mhz Dual-SPI) | SOIC8(208mil) SOIC16(300mil) WSON8(6*5mm) WSON8(8*6mm) TFBGA24(6*8mm) |
| W25Q128BVFG | 128Mb(16MB*8) | 2.7V-3.6V | -40 to +85 -40 to +105 | 104/70MHz(208/280Mhz Dual-SPI) | SOIC16(300mil) WSON8(8*6mm) TFBGA24(6*8mm) |
| W25Q256BVFG | 256Mb(32MB*8) | 2.7V-3.6V | -40°C to +85°C | 104/80MHz(208/320Mhz Dual-SPI) | SOIC16(300mil) WSON8(8*6mm) TFBGA24(6*8mm) |
以上，Winbond（華邦）Serial Flash系列產(chǎn)品特點(diǎn)總結(jié)，如您有疑問(wèn)想洽談合作，不妨來(lái)咨詢華邦flash芯片代理-深圳穎特新科技；穎特新作為Winbond代理商，將竭盡全力為您服務(wù)。0755-82591179.
編輯：admin 最后修改時(shí)間：2018-02-28
